TECHNOLOGY
Wafer alignments are wafer inspections are important and carried out mainly in all kind of Lithography process. Misalignments of bonded wafers are to be measured with the X–Y–θ axis simultaneously on wafer scale. Moreover, the measurement accuracy is to be improved to nanometer level if the fabrication errors and IR microscope resolution are allowed.

Mask aligner is useful for Thick and Thin Film Applications. A flexible and economic alternative to expensive stepper technology and are regarded as the system of choice for many enabling technologies such as MEMS, Nano Fabrication, Wafer Level Packaging or Compound Semiconductors.